Enkosi ngokutyelela iNature.com. Inguqulelo yesikhangeli oyisebenzisayo inenkxaso encinci yeCSS. Ukuze ufumane amava angcono, sicebisa ukuba usebenzise isikhangeli esihlaziyiweyo (okanye ukhubaze iMowudi yokuHlangana kwi-Internet Explorer). Okwangoku, ukuqinisekisa inkxaso eqhubekayo, siza kuyinika le ndawo ngaphandle kwezitayile kunye neJavaScript.
I-4H-SiC iye yathengiswa njengesixhobo sezixhobo ze-semiconductor zamandla. Nangona kunjalo, ukuthembeka kwexesha elide kwezixhobo ze-4H-SiC ngumqobo ekusetyenzisweni kwazo ngokubanzi, kwaye ingxaki yokuthembeka ebaluleke kakhulu yezixhobo ze-4H-SiC kukubola kwe-bipolar. Oku konakala kubangelwa kukwanda kwe-Shockley stacking fault (1SSF) yokwahlukana kwe-basal plane kwiikristale ze-4H-SiC. Apha, sicebisa indlela yokunciphisa ukwanda kwe-1SSF ngokufaka iiproton kwii-wafers ze-4H-SiC epitaxial. Ii-diode ze-PiN ezenziwe kwii-wafers ezine-proton implantation zibonise iimpawu ezifanayo zamandla ombane njengee-diode ngaphandle kokufakelwa kweproton. Ngokwahlukileyo koko, ukwanda kwe-1SSF kuncitshiswa ngempumelelo kwi-diode ye-PiN efakwe kwiproton. Ke ngoko, ukufakwa kweeproton kwii-wafers ze-4H-SiC epitaxial yindlela esebenzayo yokunciphisa ukubola kwe-bipolar kwezixhobo ze-4H-SiC zamandla ombane ngelixa kugcinwa ukusebenza kwesixhobo. Esi siphumo sinegalelo kuphuhliso lwezixhobo ze-4H-SiC ezithembekileyo kakhulu.
I-Silicon carbide (i-SiC) yaziwa kakhulu njengesixhobo se-semiconductor sezixhobo ze-semiconductor ezinamandla aphezulu, ezinokusebenza kwiindawo ezinzima1. Kukho iintlobo ezininzi ze-SiC polytypes, apho i-4H-SiC ineempawu ezibonakalayo zesixhobo se-semiconductor ezifana nokuhamba kwe-electron ephezulu kunye nentsimi yombane eqhekekileyo ngamandla2. Ii-wafers ze-4H-SiC ezinobubanzi obuzii-intshi ezi-6 okwangoku ziyathengiswa kwaye zisetyenziselwa ukuvelisa ngobuninzi izixhobo ze-semiconductor zamandla3. Iinkqubo zokudonsa izithuthi zombane kunye noololiwe zenziwe kusetyenziswa izixhobo ze-semiconductor zamandla ze-4H-SiC4.5. Nangona kunjalo, izixhobo ze-4H-SiC zisajongene nemiba yokuthembeka kwexesha elide efana nokuphazamiseka kwe-dielectric okanye ukuthembeka kwe-short-circuit,6,7 enye yezona ngxaki zibalulekileyo zokuthembeka yi-bipolar degradation2,8,9,10,11. Oku kuchithwa kwe-bipolar kwafunyanwa kwiminyaka engaphezu kwama-20 eyadlulayo kwaye kudala kwaba yingxaki ekwenziweni kwezixhobo ze-SiC.
Ukubola kwe-Bipolar kubangelwa yi-single Shockley stack defect (1SSF) kwiikristale ze-4H-SiC ezine-basal plane dislocations (BPDs) ezisasazeka nge-recombination enhanced dislocation glide (REDG)12,13,14,15,16,17,18,19. Ke ngoko, ukuba ukwandiswa kwe-BPD kucinezelwe kwi-1SSF, izixhobo zamandla ze-4H-SiC zinokwenziwa ngaphandle kokubola kwe-bipolar. Iindlela ezininzi ziye zaxelwa ukuba zicinezele ukubola kwe-BPD, njenge-BPD ukuya kwi-Thread Edge Dislocation (TED) transformation 20,21,22,23,24. Kwii-wafers zamva nje ze-SiC epitaxial, i-BPD ikhona kakhulu kwi-substrate hayi kwi-epitaxial layer ngenxa yokuguqulwa kwe-BPD ukuya kwi-TED ngexesha lokuqala lokukhula kwe-epitaxial. Ke ngoko, ingxaki eseleyo yokubola kwe-bipolar kukusasazwa kwe-BPD kwi-substrate 25,26,27. Ukufakwa "komaleko wokuqinisa odityanisiweyo" phakathi komaleko wokuntywila kunye ne-substrate kucetyisiwe njengendlela esebenzayo yokuthintela ukwanda kwe-BPD kwi-substrate28, 29, 30, 31. Olu maleko lonyusa amathuba okuphinda kuhlanganiswe i-electron-hole pair kwi-epitaxial layer kunye ne-SiC substrate. Ukunciphisa inani lee-electron-hole pairs kunciphisa amandla okuqhuba e-REDG ukuya kwi-BPD kwi-substrate, ngoko ke umaleko wokuqinisa odityanisiweyo unokuthintela ukuwohloka kwe-bipolar. Kufuneka kuqatshelwe ukuba ukufakwa komaleko kubandakanya iindleko ezongezelelweyo kwimveliso yee-wafers, kwaye ngaphandle kokufakwa komaleko kunzima ukunciphisa inani lee-electron-hole pairs ngokulawula kuphela ulawulo lobomi bomthwali. Ke ngoko, kusekho isidingo esinamandla sokuphuhlisa ezinye iindlela zokunciphisa ukufezekisa ibhalansi engcono phakathi kweendleko zokwenziwa kwezixhobo kunye nemveliso.
Ngenxa yokuba ukwandiswa kwe-BPD ukuya kwi-1SSF kufuna ukushukuma kwe-partial dislocations (PDs), ukupina i-PD yindlela ethembisayo yokuthintela ukubola kwe-bipolar. Nangona ukupina kwe-PD ngokungcola kwesinyithi kuye kwaxelwa, ii-FPD kwi-4H-SiC substrates zifumaneka kumgama ongaphezulu kwe-5 μm ukusuka kumphezulu womaleko we-epitaxial. Ukongeza, ekubeni i-diffusion coefficient yayo nayiphi na isinyithi kwi-SiC incinci kakhulu, kunzima ukuba ukungcola kwesinyithi kungene kwi-substrate34. Ngenxa yobunzima obukhulu be-atomic beesinyithi, ukufakwa kwee-ion zeesinyithi nako kunzima. Ngokwahlukileyo koko, kwimeko ye-hydrogen, eyona nto ilula, ii-ion (ii-proton) zinokufakwa kwi-4H-SiC ukuya kubunzulu obungaphezulu kwe-10 µm kusetyenziswa i-MeV-class accelerator. Ke ngoko, ukuba ukufakwa kwe-proton kuchaphazela ukupina kwe-PD, ngoko ingasetyenziselwa ukucinezela ukusasazeka kwe-BPD kwi-substrate. Nangona kunjalo, ukufakwa kwe-proton kunokonakalisa i-4H-SiC kwaye kubangele ukusebenza okunciphileyo kwesixhobo37,38,39,40.
Ukoyisa ukonakala kwesixhobo ngenxa yokufakelwa kweproton, i-annealing yobushushu obuphezulu isetyenziselwa ukulungisa umonakalo, ngendlela efanayo nendlela ye-annealing esetyenziswa rhoqo emva kokufakelwa kwe-ion ye-acceptor ekucutshungulweni kwesixhobo1, 40, 41, 42. Nangona i-secondary ion mass spectrometry (SIMS)43 ibike ukusasazeka kwe-hydrogen ngenxa yokufakelwa kwe-high-temperature, kunokwenzeka ukuba kuphela uxinano lwee-athomu ze-hydrogen ezikufutshane ne-FD alwanelanga ukubona ukugoba kwe-PR kusetyenziswa i-SIMS. Ke ngoko, kolu phononongo, sifake ii-proton kwii-wafers ze-4H-SiC epitaxial ngaphambi kwenkqubo yokwenziwa kwesixhobo, kubandakanya i-annealing yobushushu obuphezulu. Sisebenzise ii-PiN diodes njengezakhiwo zesixhobo sovavanyo kwaye sazenza kwii-wafers ze-4H-SiC epitaxial ezifakwe kwiproton. Emva koko sabona iimpawu ze-volt-ampere ukuze sifunde ukonakala kokusebenza kwesixhobo ngenxa yokufakwa kweproton. Emva koko, sabona ukwanda kwe-1SSF kwimifanekiso ye-electroluminescence (EL) emva kokusebenzisa i-voltage yombane kwi-PiN diode. Ekugqibeleni, siqinisekisile isiphumo sokufakwa kweproton ekuthintelweni kokwandiswa kwe-1SSF.
Kumfanekiso 1. Umfanekiso 1 ubonisa iimpawu zamandla angoku-voltage (ii-CVC) zee-PiN diodes kubushushu begumbi kwiindawo ezine-proton implantation kunye nezingenayo ngaphambi kokuba kubekho i-pulsed current. Ii-PiN diodes ezine-proton injection zibonisa iimpawu zokulungisa ezifana nee-diodes ezingenayo i-proton injection, nangona iimpawu ze-IV zabelwana ngazo phakathi kwee-diodes. Ukubonisa umahluko phakathi kweemeko ze-injection, sidwebe i-voltage frequency kwi-forward current density ye-2.5 A/cm2 (ehambelana ne-100 mA) njenge-statistical plot njengoko kubonisiwe kuMfanekiso 2. I-curve eqikelelwa kukusasazwa okuqhelekileyo ikwamelwa ngumgca womgca onamachaphaza. Njengoko kunokubonwa kwiincopho zee-curves, i-on-resistance iyanda kancinci kwiidosi ze-proton ze-1014 kunye ne-1016 cm-2, ngelixa i-PiN diode ene-proton dose ye-1012 cm-2 ibonisa phantse iimpawu ezifanayo nezo zingenayo i-proton implantation. Sikwaqhube nokufakelwa kweproton emva kokwenziwa kwee-PiN diodes ezingakhange zibonise i-electroluminescence efanayo ngenxa yomonakalo obangelwe kukufakelwa kweproton njengoko kubonisiwe kuMfanekiso S1 njengoko kuchaziwe kwizifundo zangaphambili37,38,39. Ke ngoko, ukutsalwa kwi-1600 °C emva kokufakelwa kwee-Al ions yinkqubo efunekayo yokwenza izixhobo zokuvula i-Al acceptor, enokulungisa umonakalo obangelwe kukufakelwa kweproton, okwenza ii-CVC zifane phakathi kwee-proton PiN diodes ezifakelweyo nezingezizo ezifakelweyo. I-frequency yangoku ebuyela umva kwi--5 V ikwaboniswe kuMfanekiso S2, akukho mahluko ubalulekileyo phakathi kwee-diodes ezine-proton injection kunye nezingenayo.
Iimpawu ze-Volt-ampere zee-diode ze-PiN ezinee-proton ezifakwe kwiqondo lobushushu begumbi kunye nezingenazo. Le ntsomi ibonisa idosi yee-proton.
I-voltage frequency kwi-direct current eyi-2.5 A/cm2 kwii-PiN diodes ezinee-proton ezijoyiweyo nezingejoyiweyo. Umgca onamachaphaza uhambelana nokusasazwa okuqhelekileyo.
Kumfanekiso 3 ubonisa umfanekiso we-EL we-PiN diode enobunzima bangoku obuyi-25 A/cm2 emva kwe-voltage. Ngaphambi kokusebenzisa umthwalo wangoku oshukumayo, iindawo ezimnyama ze-diode azibonwanga, njengoko kubonisiwe kuMfanekiso 3. C2. Nangona kunjalo, njengoko kubonisiwe kumfanekiso 3a, kwi-PiN diode ngaphandle kokufakelwa kwe-proton, iindawo ezininzi ezimnyama ezinemigca ekhanyayo zabonwa emva kokusebenzisa i-voltage yombane. Ezi ndawo zimnyama ezimile njengentonga zibonwa kwimifanekiso ye-EL ye-1SSF ephuma kwi-BPD kwi-substrate28,29. Endaweni yoko, ezinye iimpazamo zokubeka ezinde zabonwa kwii-PiN diodes ezinee-proton ezifakelweyo, njengoko kubonisiwe kuMfanekiso 3b–d. Sisebenzisa i-X-ray topography, siqinisekisile ukubakho kwee-PRs ezinokusuka kwi-BPD ziye kwi-substrate kumda wee-contacts kwi-PiN diode ngaphandle kwe-proton injection (Umzobo 4: lo mfanekiso ngaphandle kokususa i-electrode ephezulu (ifotwe, i-PR phantsi kwee-electrodes ayibonakali). Ke ngoko, indawo emnyama kumfanekiso we-EL ihambelana ne-1SSF BPD eyandisiweyo kwi-substrate. Imifanekiso ye-EL yezinye ii-PiN diodes ezilayishiweyo iboniswe kwiMifanekiso 1 kunye no-2. Iividiyo ze-S3-S6 ezineendawo ezimnyama ezinde nezingenazo (imifanekiso ye-EL etshintsha ixesha yee-PiN diodes ngaphandle kwe-proton injection kwaye ifakwe kwi-1014 cm-2) nazo ziboniswe kwi-Supplementary Information.
Imifanekiso ye-EL yee-PiN diodes kwi-25 A/cm2 emva kweeyure ezi-2 zoxinzelelo lombane (a) ngaphandle kokufakelwa kweproton kunye needosi ezifakwe kwi-(b) 1012 cm-2, (c) 1014 cm-2 kunye (d) 1016 cm-2 protons.
Sibale uxinano lwe-1SSF eyongeziweyo ngokubala iindawo ezimnyama ezinemiphetho ekhanyayo kwii-diode ezintathu zePiN kwimeko nganye, njengoko kubonisiwe kuMfanekiso 5. Uxinano lwe-1SSF eyongeziweyo luyehla ngokwandisa idosi yeproton, kwaye nokuba idosi ye-1012 cm-2, uxinano lwe-1SSF eyongeziweyo luphantsi kakhulu kunakwi-diode yePiN engafakwanga.
Ukwanda koxinano lwee-diode ze-SF PiN ezine-proton implantation kunye nezingenayo emva kokulayisha nge-pulsed current (imeko nganye yayiquka ii-diode ezintathu ezilayishiweyo).
Ukufinyeza ubomi bomthwali kukwachaphazela ukuncitshiswa kokwandiswa, kwaye ukujova kweproton kunciphisa ubomi bomthwali32,36. Sibone ubomi bomthwali kumaleko we-epitaxial 60 µm ubukhulu kunye neeproton ezijoviweyo ze-1014 cm-2. Ukususela kwixesha lokuqala lokuthwala, nangona i-implant inciphisa ixabiso ukuya kwi-~10%, i-annealing elandelayo iyibuyisela kwi-~50%, njengoko kubonisiwe kwiFig. S7. Ke ngoko, ixesha lokuthwala, elincitshisiweyo ngenxa yokufakelwa kweproton, libuyiselwa ngokujova kobushushu obuphezulu. Nangona ukunciphisa kwe-50% kubomi bomthwali kukwathintela ukwanda kweempazamo zokubeka, iimpawu ze-I–V, ezihlala zixhomekeke kubomi bomthwali, zibonisa umahluko omncinci kuphela phakathi kwee-diode ezijoviweyo nezingezizo ezijoviweyo. Ke ngoko, sikholelwa ukuba i-PD anchoring idlala indima ekuthinteleni ukwanda kwe-1SSF.
Nangona i-SIMS ingazange iyifumane i-hydrogen emva kokufakwa kwi-1600°C, njengoko kubikwe kwizifundo zangaphambili, sibone isiphumo sokufakelwa kweproton ekuthintelweni kokwandiswa kwe-1SSF, njengoko kubonisiwe kwiMifanekiso 1 kunye no-4. 3, 4. Ke ngoko, sikholelwa ukuba i-PD inamathele kwiiathom ze-hydrogen ezinobunzima obungaphantsi komda wokufunyanwa kwe-SIMS (2 × 1016 cm-3) okanye iziphene zenqaku ezibangelwa kukufakelwa. Kufuneka kuqatshelwe ukuba asikaqinisekisi ukwanda kokumelana kwimeko ngenxa yokwandiswa kwe-1SSF emva komthwalo wamandla okunyuka. Oku kusenokuba kungenxa yoqhagamshelwano olungaphelelanga lwe-ohmic olwenziwe kusetyenziswa inkqubo yethu, oluya kupheliswa kungekudala.
Ukuqukumbela, siphuhlise indlela yokucima yokwandisa i-BPD ukuya kwi-1SSF kwii-diode ze-4H-SiC PiN sisebenzisa i-proton implantation ngaphambi kokwenziwa kwesixhobo. Ukuwohloka kophawu lwe-I–V ngexesha lokufakelwa kweproton akunamsebenzi, ingakumbi kwidosi ye-proton eyi-1012 cm–2, kodwa isiphumo sokuthintela ukwanda kwe-1SSF sibalulekile. Nangona kolu phononongo senze ii-diode ze-PiN ezinobukhulu obuyi-10 µm kunye ne-proton implantation ukuya kubunzulu be-10 µm, kusenokwenzeka ukuphucula ngakumbi iimeko zokufakelwa kwaye sizisebenzise ukwenza ezinye iintlobo zezixhobo ze-4H-SiC. Iindleko ezongezelelweyo zokwenza isixhobo ngexesha lokufakelwa kweproton kufuneka ziqwalaselwe, kodwa ziya kufana nezo zokufakelwa kwe-aluminium ion, eyinkqubo ephambili yokwenza izixhobo zamandla ze-4H-SiC. Ke ngoko, ukufakelwa kweproton ngaphambi kokucubungula isixhobo yindlela enokwenzeka yokwenza izixhobo zamandla ze-4H-SiC bipolar ngaphandle kokonakala.
I-wafer ye-4-intshi n-type 4H-SiC enobukhulu be-epitaxial layer ye-10 µm kunye ne-doping concentration ye-donor ye-1 × 1016 cm–3 yasetyenziswa njengesampulu. Ngaphambi kokucubungula isixhobo, ii-H+ ions zafakwa kwipleyiti ngamandla okukhawulezisa e-0.95 MeV kubushushu begumbi ukuya kubunzulu obumalunga ne-10 μm kwi-engile eqhelekileyo kumphezulu wepleyiti. Ngexesha lokufakelwa kweproton, kwasetyenziswa imaski kwipleyiti, kwaye ipleyiti yayineendawo ezingenazo kwaye ine-proton dose ye-1012, 1014, okanye i-1016 cm-2. Emva koko, ii-Al ions ezine-proton doses ze-1020 kunye ne-1017 cm–3 zafakwa phezu kwe-wafer yonke ukuya kubunzulu be-0–0.2 µm kunye ne-0.2–0.5 µm ukusuka kumphezulu, kulandele i-annealing kwi-1600°C ukwenza i-carbon cap ukwenza i-ap layer. -type. Emva koko, uqhagamshelwano lweNi olungasemva lubekwe kwicala lesiseko, ngelixa uqhagamshelwano olungaphambili lweTi/Al oluyimilo ye-2.0 mm × 2.0 mm lwenziwe yi-photolithography kwaye inkqubo yokukhupha ibekwe kwicala le-epitaxial layer. Ekugqibeleni, ukucoca uqhagamshelwano kwenziwa kubushushu obuyi-700 °C. Emva kokusika i-wafer ibe ziitships, senze uhlalutyo loxinzelelo kunye nokusetyenziswa.
Iimpawu ze-I–V zee-PiN diodes ezenziweyo zibonwe kusetyenziswa i-HP4155B semiconductor parameter analyzer. Njengoxinzelelo lombane, i-10-millisecond pulsed current ye-212.5 A/cm2 yaziswa iiyure ezi-2 kwi-frequency ye-10 pulses/sec. Xa sikhetha i-current density okanye i-frequency esezantsi, asizange sibone ukwanda kwe-1SSF nakwi-PiN diode ngaphandle kwe-proton injection. Ngexesha le-voltage yombane esetyenzisiweyo, ubushushu be-PiN diode bumalunga ne-70°C ngaphandle kokufudumeza ngabom, njengoko kubonisiwe kuMfanekiso S8. Imifanekiso ye-Electroluminescent ifunyenwe ngaphambi nasemva koxinzelelo lombane kwi-current density ye-25 A/cm2. I-Synchrotron reflection grazing incidence X-ray topography isebenzisa i-monochromatic X-ray beam (λ = 0.15 nm) kwi-Aichi Synchrotron Radiation Center, i-ag vector kwi-BL8S2 yi--1-128 okanye i-11-28 (jonga ireferensi 44 ukuze ufumane iinkcukacha).).
I-voltage frequency kwi-forward current density ye-2.5 A/cm2 ikhutshwa nge-interval ye-0.5 V kumzobo 2 ngokwe-CVC yemeko nganye ye-PiN diode. Ukusuka kwi-mean value ye-stress Vave kunye ne-standard deviation σ ye-stress, sidweba i-normal distribution curve ngendlela yomgca onamachaphaza kuMfanekiso 2 sisebenzisa i-equation elandelayo:
UWerner, MR kunye noFahrner, WR Uphononongo lwezixhobo, ii-microsensors, iinkqubo kunye nezixhobo zezicelo zobushushu obuphezulu kunye nokusingqongileyo okungqongqo. UWerner, MR kunye noFahrner, WR Uphononongo lwezixhobo, ii-microsensors, iinkqubo kunye nezixhobo zezicelo zobushushu obuphezulu kunye nokusingqongileyo okungqongqo.UWerner, MR kunye noFarner, WR Isishwankathelo sezixhobo, ii-microsensors, iinkqubo kunye nezixhobo zokusetyenziswa kwiindawo ezinobushushu obuphezulu kunye neendawo ezinzima. Werner, MR & Fahrner, WR 对用于高温和恶劣环境应用的材料、微传感器、系统和设备的评论。 UWerner, MR kunye noFahrner, WR Uphononongo lwezixhobo, ii-microsensors, iinkqubo kunye nezixhobo zokusetyenziswa kobushushu obuphezulu kunye nokusingqongileyo okubi.UWerner, MR kunye noFarner, WR Isishwankathelo sezixhobo, ii-microsensors, iinkqubo kunye nezixhobo zokusetyenziswa kumaqondo obushushu aphezulu nakwiimeko ezinzima.IEEE Trans. Izixhobo zombane zezimboni. 48, 249–257 (2001).
UKimoto, T. kunye noCooper, JA Iziseko zeTekhnoloji yeSilicon Carbide Iziseko zeTekhnoloji yeSilicon Carbide: Ukukhula, Ukuchazwa kweeMpawu, Izixhobo kunye neZicelo Vol. UKimoto, T. kunye noCooper, JA Iziseko zeTekhnoloji yeSilicon Carbide Iziseko zeTekhnoloji yeSilicon Carbide: Ukukhula, Ukuchazwa kweeMpawu, Izixhobo kunye neZicelo Vol.UKimoto, T. kunye noCooper, JA Iziseko zeTekhnoloji yeSilicon Carbide Iziseko zeTekhnoloji yeSilicon Carbide: Ukukhula, Iimpawu, Izixhobo kunye neZicelo Vol. Kimoto, T. & Cooper, JA 碳化硅技术基础碳化硅技术基础:增长、表征、设备和应用卷。 UKimoto, T. kunye noCooper, JA Isiseko setekhnoloji ye-carbon化silicon Isiseko setekhnoloji ye-carbon化silicon: ukukhula, inkcazo, izixhobo kunye nomthamo wokusetyenziswa.UKimoto, T. kunye noCooper, J. Iziseko zeTekhnoloji yeSilicon Carbide Iziseko zeTekhnoloji yeSilicon Carbide: Ukukhula, Iimpawu, Izixhobo kunye noSetyenziso Vol.252 (Wiley Singapore Pte Ltd, 2014).
UVeliadis, V. Urhwebo Olukhulu lweSiC: Imeko Ekhoyo kunye Nemiqobo Ekufuneka Yoyiswe. alma mater. isayensi. IForam 1062, 125–130 (2022).
UBroughton, J., Smet, V., Tummala, RR kunye noJoshi, YK Uphononongo lwetekhnoloji yokupakisha ubushushu kwiimoto ezisebenzisa amandla e-elektroniki ngeenjongo zokutsala. UBroughton, J., Smet, V., Tummala, RR kunye noJoshi, YK Uphononongo lwetekhnoloji yokupakisha ubushushu kwiimoto ezisebenzisa amandla e-elektroniki ngeenjongo zokutsala.Broughton, J., Smet, V., Tummala, RR kunye noJoshi, YK Isishwankathelo setekhnoloji yokupakisha ubushushu kwiimoto ezisebenzisa amandla e-elektroniki ngeenjongo zokutsala. Broughton, J., Smet, V., Tummala, RR & Joshi, YK 用于牵引目的汽车电力电子热封装技术的回顾. Broughton, J., Smet, V., Tummala, RR & Joshi, YKBroughton, J., Smet, V., Tummala, RR kunye noJoshi, YK Isishwankathelo setekhnoloji yokupakisha ubushushu kwiimoto ezisebenzisa amandla e-elektroniki ngeenjongo zokutsala.J. Electron. Iphakheji. i-trance. ASME 140, 1-11 (2018).
USato, K., uKato, H. kunye noFukushima, T. Uphuhliso lwenkqubo yokubamba esetyenziswa yiSiC koololiwe abasebenzisa isantya esiphezulu besizukulwana esilandelayo saseShinkansen. USato, K., uKato, H. kunye noFukushima, T. Uphuhliso lwenkqubo yokubamba esetyenziswa yiSiC koololiwe abasebenzisa isantya esiphezulu besizukulwana esilandelayo saseShinkansen.USato K., uKato H. kunye noFukushima T. Uphuhliso lwenkqubo yokubamba iSiC esetyenziswayo kwiitreyini zeShinkansen zesizukulwana esilandelayo.USato K., uKato H. kunye noFukushima T. Uphuhliso lweNkqubo yokuThatha iiMoto kwiZicelo zeSiC zooLoliwe beShinkansen abakwiSizalo esilandelayo. Isihlomelo IEEJ J. Ind. 9, 453–459 (2020).
USenzaki, J., uHayashi, S., uYonezawa, Y. kunye no-Okumura, H. Imingeni yokufumana izixhobo zamandla zeSiC ezithembekileyo kakhulu: Ukusuka kwimeko yangoku kunye nemiba yee-wafers zeSiC. USenzaki, J., uHayashi, S., uYonezawa, Y. kunye no-Okumura, H. Imingeni yokufumana izixhobo zamandla zeSiC ezithembekileyo kakhulu: Ukusuka kwimeko yangoku kunye nemiba yee-wafers zeSiC.USenzaki, J., uHayashi, S., uYonezawa, Y. kunye no-Okumura, H. Iingxaki ekusetyenzisweni kwezixhobo zamandla zeSiC ezithembekileyo kakhulu: ukuqala kwimeko yangoku kunye nengxaki ye-wafer SiC. Senzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. 实现高可靠性SiC 功率器件的挑战:从SiC 晶圆的现状和问题來。 Senzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. Umceli mngeni wokufumana ukuthembeka okuphezulu kwizixhobo zamandla ze-SiC: ukusuka kwi-SiC 晶圆的电视和问题设计。USenzaki J, uHayashi S, uYonezawa Y. kunye no-Okumura H. Imingeni ekuphuhlisweni kwezixhobo zamandla ezinokuthembeka okuphezulu ezisekelwe kwi-silicon carbide: uphononongo lwemeko kunye neengxaki ezinxulumene nee-wafers ze-silicon carbide.Kwi-IEEE International Symposium ka-2018 kwiFiziksi yokuthembeka (i-IRPS). (USenzaki, J. et al. eds.) 3B.3-1-3B.3-6 (IEEE, 2018).
UKim, D. kunye noSung, W. Ukuphucula ubulukhuni be-short-circuit kwi-1.2kV 4H-SiC MOSFET kusetyenziswa i-P-well enzulu eyenziwe ngokufaka i-channeling. UKim, D. kunye noSung, W. Ukuphucula ubulukhuni be-short-circuit kwi-1.2kV 4H-SiC MOSFET kusetyenziswa i-P-well enzulu eyenziwe ngokufaka i-channeling.UKim, D. kunye noSung, V. Ukuphucula ukhuseleko lwe-short-circuit kwi-1.2 kV 4H-SiC MOSFET kusetyenziswa i-P-well enzulu eyenziwe ngokufakelwa kwetshaneli. UKim, D. & Sung, W. 使用通过沟道注入实现的深P 阱提高了1.2kV 4H-SiC MOSFET 的短路耐用性。 UKim, D. & Sung, W. P 阱提高了1.2kV 4H-SiC MOSFETUKim, D. kunye noSung, V. Ukuphucula ukunyamezelana kwe-short-circuit ye-1.2 kV 4H-SiC MOSFETs kusetyenziswa ii-P-wells ezinzulu ngokufakelwa kwe-channel.Izixhobo ze-elektroniki ze-IEEE Lett. 42, 1822–1825 (2021).
USkowronski M. et al. Intshukumo ephuculweyo yokuphinda-phinda yeempazamo kwiidiode ze-pn ze-4H-SiC ezijolise phambili. J. Application. physics. 92, 4699–4704 (2002).
Ha, S., Mieszkowski, P., Skowronski, M. kunye noRowland, LB Ukuguqulwa kwe-Dislocation kwi-4H silicon carbide epitaxy. Ha, S., Mieszkowski, P., Skowronski, M. kunye noRowland, LB Ukuguqulwa kwe-Dislocation kwi-4H silicon carbide epitaxy.UHa S., uMeszkowski P., uSkowronski M. kunye noRowland LB Dislocation transformation ngexesha le-4H silicon carbide epitaxy. Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, LB 4H 碳化硅外延中的位错转换。 Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, LB 4H Ha, S., Meszkowski, P., Skowronski, M. & Rowland, LBUtshintsho lwe-dislocation 4H kwi-silicon carbide epitaxy.J. Crystal. Ukukhula 244, 257–266 (2002).
USkowronski, M. kunye noHa, S. Ukonakala kwezixhobo ze-bipolar ezisekelwe kwi-silicon-carbide ezine-hexagonal. USkowronski, M. kunye noHa, S. Ukonakala kwezixhobo ze-bipolar ezisekelwe kwi-silicon-carbide ezine-hexagonal.USkowronski M. kunye noHa S. Ukonakala kwezixhobo ze-bipolar ezine-hexagonal ezisekelwe kwi-silicon carbide. Skowronski, M. & Ha, S. 六方碳化硅基双极器件的降解. USkowronski M. kunye noHa S.USkowronski M. kunye noHa S. Ukonakala kwezixhobo ze-bipolar ezine-hexagonal ezisekelwe kwi-silicon carbide.J. Isicelo. ifiziksi 99, 011101 (2006).
UAgarwal, A., uFatima, H., uHaney, S. kunye noRyu, S.-H. UAgarwal, A., uFatima, H., uHaney, S. kunye noRyu, S.-H.UAgarwal A., uFatima H., uHeini S. kunye noRyu S.-H. UAgarwal, A., uFatima, H., uHaney, S. kunye noRyu, S.-H. UAgarwal, A., uFatima, H., uHaney, S. kunye noRyu, S.-H.UAgarwal A., uFatima H., uHeini S. kunye noRyu S.-H.Indlela entsha yokuhla kwe-MOSFETs yamandla e-SiC aphezulu. Izixhobo ze-elektroniki ze-IEEE Lett. 28, 587–589 (2007).
UCaldwell, JD, Stahlbush, RE, Ancona, MG, Glembocki, OJ kunye noHobart, KD Ngamandla aqhuba intshukumo yempazamo yokuqingqa okubangelwa kukuphinda-phinda kwi-4H–SiC. UCaldwell, JD, Stahlbush, RE, Ancona, MG, Glembocki, OJ kunye noHobart, KD Ngamandla aqhuba intshukumo yempazamo yokudibanisa i-stacking ebangelwa yi-recombination kwi-4H-SiC.UCaldwell, JD, uStalbush, RE, uAncona, uMG, uGlemboki, OJ, kunye noHobart, KD Ngamandla aqhubayo entshukumo yempazamo yokuqiniswa kwe-stacking ebangelwa yi-recombination kwi-4H-SiC. Caldwell, JD, Stahlbush, RE, Ancona, MG, Glembocki, OJ & Hobart, KD 关于4H-SiC 中复合引起的层错运动的驱动力。 Caldwell, JD, Stahlbush, RE, Ancona, MG, Glembocki, OJ & Hobart, KDUCaldwell, JD, Stalbush, RE, Ancona, MG, Glemboki, OJ, kunye noHobart, KD, Ngamandla aqhubayo entshukumo yempazamo yokuqiniswa kwe-recombination kwi-4H-SiC.J. Isicelo. ifiziksi. 108, 044503 (2010).
Iijima, A. kunye noKimoto, T. Imodeli yamandla e-elektroniki yokwenza impazamo ye-Shockley stacking enye kwiikristale ze-4H-SiC. Iijima, A. kunye noKimoto, T. Imodeli yamandla e-elektroniki yokwenza impazamo ye-Shockley stacking enye kwiikristale ze-4H-SiC.Iijima, A. kunye noKimoto, T. Imodeli ye-electron-energy yokwenziwa kweziphene ezilodwa zokupakisha iShockley kwiikristale ze-4H-SiC. Iijima, A. & Kimoto, T. 4H-SiC 晶体中单Shockley 堆垛层错形成的电子能量模型. Iijima, A. kunye noKimoto, T. Imodeli yamandla e-elektroniki yokwenziwa kwempazamo enye yeShockley stacking kwikristale ye-4H-SiC.Iijima, A. kunye noKimoto, T. Imodeli ye-electron-energy yokwenziwa kwe-single defect Shockley packing kwiikristale ze-4H-SiC.J. Isicelo. ifiziksi 126, 105703 (2019).
Iijima, A. kunye noKimoto, T. Uqikelelo lwemeko ebalulekileyo yokwandiswa/ukuncitshiswa kweempazamo ze-single Shockley stacking kwii-diode ze-4H-SiC PiN. Iijima, A. kunye noKimoto, T. Uqikelelo lwemeko ebalulekileyo yokwandiswa/ukuncitshiswa kweempazamo ze-single Shockley stacking kwii-diode ze-4H-SiC PiN.Iijima, A. kunye noKimoto, T. Uqikelelo lwemeko ebalulekileyo yokwandiswa/ukucinezelwa kweziphene zokupakisha zeShockley enye kwi-4H-SiC PiN-diodes. Iijima, A. & Kimoto, T. 估计4H-SiC PiN 二极管中单个Shockley 堆垛层错膨胀/收缩的临界条件。 Iijima, A. kunye noKimoto, T. Uqikelelo lweemeko zokwandiswa/ukucutheka kweleya enye yeShockley stacking kwi-4H-SiC PiN diodes.Iijima, A. kunye noKimoto, T. Uqikelelo lweemeko ezibalulekileyo zokwandiswa/ukucinezelwa kokupakisha isiphene esinye I-Shockley kwii-diode ze-4H-SiC PiN.ifiziksi yesicelo iWright. 116, 092105 (2020).
UMannen, Y., uShimada, K., uAsada, K. kunye no-Ohtani, N. Imodeli yesenzo seQuantum well yokwenza i-single Shockley stacking fault kwi-crystal ye-4H-SiC phantsi kweemeko ezingezizo ezokulingana. UMannen, Y., uShimada, K., uAsada, K. kunye no-Ohtani, N. Imodeli yesenzo seQuantum well yokwenza i-single Shockley stacking fault kwi-crystal ye-4H-SiC phantsi kweemeko ezingezizo ezokulingana.UMannen Y., uShimada K., uAsada K., kunye no-Otani N. Imodeli ye-quantum well yokwenza i-single Shockley stacking fault kwi-crystal ye-4H-SiC phantsi kweemeko ezingezizo ezokulingana.UMannen Y., uShimada K., uAsada K. kunye no-Otani N. Imodeli yokusebenzisana kweQuantum well yokwenza iimpazamo ze-single Shockley stacking kwiikristale ze-4H-SiC phantsi kweemeko ezingezizo ezokulingana. J. Application. physics. 125, 085705 (2019).
UGaleckas, A., Linnros, J. kunye noPirouz, P. Iziphene zokudibanisa izinto ezibangelwa kukuphinda-phinda: Ubungqina bendlela yokusebenza ngokubanzi kwi-SiC ene-hexagonal. UGaleckas, A., Linnros, J. kunye noPirouz, P. Iziphene zokudibanisa izinto ezibangelwa kukuphinda-phinda: Ubungqina bendlela yokusebenza ngokubanzi kwi-SiC ene-hexagonal.UGaleckas, A., uLinnros, J. kunye noPirouz, P. Iziphene zokupakisha ezibangelwa kukuphinda-phinda: Ubungqina bendlela eqhelekileyo yokusebenza kwi-Hexagonal SiC. Galeckas, A., Linnros, J. & Pirouz, P. 复合诱导的堆垛层错:六方SiC 中一般机制的证据。 UGaleckas, A., Linnros, J. kunye noPirouz, P. Ubungqina bendlela eqhelekileyo yokusebenza kwe-composite induction stacking layer: 六方SiC.UGaleckas, A., uLinnros, J. kunye noPirouz, P. Iziphene zokupakisha ezibangelwa kukuphinda-phinda: Ubungqina bendlela eqhelekileyo yokusebenza kwi-Hexagonal SiC.ifiziksi uMfundisi uWright. 96, 025502 (2006).
U-Ishikawa, Y., uSudo, uM., uYao, uY.-Z., uSugawara, uY. kunye noKato, uM. Ukwandiswa kwempazamo enye yeShockley stacking kwi-4H-SiC (11 2 ¯0) epitaxial layer ebangelwa yi-electron beam irradiation.Ishikawa, Y., M. Sudo, Ukukhanya kwemitha ye-Y.-Z.Ishikawa, Y., Sudo M., Y.-Z Psychology.Ibhokisi, Ю., M. Судо, Y.-Z Chem., J. Chem., 123, 225101 (2018).
Kato, M., Katahira, S., Ichikawa, Y., Harada, S. kunye noKimoto, T. Ukujongwa kokuhlanganiswa kwakhona kwe-carriers kwi-single Shockley stacking faults kunye ne-partial dislocations kwi-4H-SiC. Kato, M., Katahira, S., Ichikawa, Y., Harada, S. kunye noKimoto, T. Ukujongwa kokuhlanganiswa kwakhona kwe-carriers kwi-single Shockley stacking faults kunye ne-partial dislocations kwi-4H-SiC.Kato M., Katahira S., Itikawa Y., Harada S. kunye noKimoto T. Ukujongwa koHlanganiso lweCarrier kwiSiphene sokuPakisha esinye kunye nokuKhutshwa okuNgaphelelanga kwi-4H-SiC. Kato, M., Katahira, S., Ichikawa, Y., Harada, S. & Kimoto, T. 单Shockley 堆垛层错和4H-SiC 部分位错中载流子复合的观察. Kato, M., Katahira, S., Ichikawa, Y., Harada, S. & Kimoto, T. 单Shockley ukupakisha kunye ne4H-SiC inxalenye ye-位错中载流子去生的可以。Kato M., Katahira S., Itikawa Y., Harada S. kunye noKimoto T. Ukujongwa koHlanganiso lweCarrier kwiSiphene sokuPakisha esinye kunye nokuKhutshwa okuNgaphelelanga kwi-4H-SiC.J. Isicelo. ifiziksi 124, 095702 (2018).
UKimoto, T. kunye noWatanabe, H. Ubunjineli obungenaziphene kwitekhnoloji yeSiC kwizixhobo zamandla ezinamandla aphezulu. UKimoto, T. kunye noWatanabe, H. Ubunjineli obungenaziphene kwitekhnoloji yeSiC kwizixhobo zamandla ezinamandla aphezulu.UKimoto, T. kunye noWatanabe, H. Uphuhliso lweziphene kwitekhnoloji yeSiC kwizixhobo zamandla ezinamandla aphezulu. Kimoto, T. & Watanabe, H. 用于高压功率器件的SiC 技术中的缺陷工程。 UKimoto, T. kunye noWatanabe, H. Ubunjineli obungenaziphene kwitekhnoloji yeSiC kwizixhobo zamandla ezinamandla aphezulu.UKimoto, T. kunye noWatanabe, H. Uphuhliso lweziphene kwitekhnoloji yeSiC kwizixhobo zamandla ezinamandla aphezulu.ifiziksi yesicelo i-Express 13, 120101 (2020).
UZhang, Z. kunye noSudarshan, TS I-epitaxy ye-silicon carbide engenalo ukususwa kwendiza ye-Basal plane. UZhang, Z. kunye noSudarshan, TS I-epitaxy ye-silicon carbide engenalo ukususwa kwendiza ye-Basal plane.UZhang Z. kunye noSudarshan TS Dislocation-free epitaxy yesilicon carbide kwi-basal plane. Zhang, Z. & Sudarshan, TS 碳化硅基面无位错外延。 UZhang, Z. kunye noSudarshan, TSUZhang Z. kunye noSudarshan TS Dislocation-free epitaxy ye-silicon carbide basal planes.ingxelo. ifiziksi. uWright. 87, 151913 (2005).
UZhang, Z., uMoulton, u-E. kunye noSudarshan, TS Indlela yokuphelisa ukusasazeka kwe-basal plane kwiifilimu ezincinci ze-SiC nge-epitaxy kwi-substrate eqoshiweyo. UZhang, Z., uMoulton, u-E. kunye noSudarshan, TS Indlela yokuphelisa ukusasazeka kwe-basal plane kwiifilimu ezincinci ze-SiC nge-epitaxy kwi-substrate eqoshiweyo.UZhang Z., uMoulton E. kunye noSudarshan TS Indlela yokususa ukusasazeka kwesiseko seplane kwiifilimu ezincinci zeSiC yi-epitaxy kwi-substrate eqingqiweyo. Zhang, Z., Moulton, E. & Sudarshan, TS 通过在蚀刻衬底上外延消除SiC 薄膜中基面位错的机制. UZhang, Z., uMoulton, u-E. kunye noSudarshan, TS Indlela yokususa ifilimu encinci ye-SiC ngokukrola i-substrate.UZhang Z., uMoulton E. kunye noSudarshan TS Indlela yokususa ukusasazeka kwesiseko seplane kwiifilimu ezincinci zeSiC yi-epitaxy kwi-substrates ezikroliweyo.ifiziksi yesicelo iWright. 89, 081910 (2006).
UShtalbush RE et al. Ukuphazamiseka kokukhula kukhokelela ekunciphiseni ukusasazeka kwe-basal plane ngexesha le-4H-SiC epitaxy. statement. physics. Wright. 94, 041916 (2009).
UZhang, X. kunye noTsuchida, H. Ukuguqulwa kokususwa kwe-basal plane ukuya kwi-threading edge dislocations kwi-4H-SiC epilayers ngokutsalwa kobushushu obuphezulu. UZhang, X. kunye noTsuchida, H. Ukuguqulwa kokususwa kwe-basal plane ukuya kwi-threading edge dislocations kwi-4H-SiC epilayers ngokutsalwa kobushushu obuphezulu.UZhang, X. kunye noTsuchida, H. Ukuguqulwa kokususwa kwe-basal plane kube kukususwa kwe-threading edge kwi-4H-SiC epitaxial layers ngokutsalwa kwe-high temperature annealing. Zhang, X & Tsuchida, H. 通过高温退火将4H-SiC 外延层中的基面位错转化為螺纹刃位错. Zhang, X. & Tsuchida, H. 通过高温退火将4H-SiCUZhang, X. kunye noTsuchida, H. Ukuguqulwa kokususwa kwesiseko seplane kube kukususwa komphetho wefilament kwiileya ze-epitaxial ze-4H-SiC ngokutsalwa kobushushu obuphezulu.J. Isicelo. ifiziksi. 111, 123512 (2012).
I-Song, H. kunye ne-Sudarshan, TS Ukuguqulwa kwe-Basal plane dislocation kufutshane ne-epilayer/substrate interface ekukhuleni kwe-epitaxial kwe-4° off-axis 4H–SiC. I-Song, H. kunye ne-Sudarshan, TS Ukuguqulwa kwe-Basal plane dislocation kufutshane ne-epilayer/substrate interface ekukhuleni kwe-epitaxial kwe-4° off-axis 4H–SiC.Ingoma, H. kunye neSudarshan, TS Utshintsho lwe-basal plane dislocations kufutshane ne-epitaxial layer/substrate interface ngexesha lokukhula kwe-off-axis epitaxial ye-4H-SiC. Ingoma, H. & Sudarshan, TS 在4° 离轴4H-SiC 外延生长中外延层/衬底界面附近的基底平面位错转换。 Ingoma, H. & Sudarshan, TS 在4° 离轴4H-SiC Ingoma, H. kunye neSudarshan, TSUtshintsho lwe-planar dislocation lwe-substrate kufutshane nomda we-epitaxial layer/substrate ngexesha lokukhula kwe-epitaxial ye-4H-SiC ngaphandle kwe-4° axis.J. Crystal. Ukukhula 371, 94–101 (2013).
UKonishi, K. et al. Kwi-current ephezulu, ukusasazeka kwe-basal plane dislocation stacking fault kwiileya ze-4H-SiC epitaxial kuguquka kube kukwahlukana komphetho we-filament. J. Application. physics. 114, 014504 (2013).
UKonishi, K. et al. Yila iileya ze-epitaxial ze-bipolar non-degradable SiC MOSFETs ngokufumanisa iindawo ezinde ze-stacking fault nucleation kuhlalutyo lwe-X-ray topographic olusebenzayo. I-AIP Advanced 12, 035310 (2022).
ULin, S. et al. Impembelelo yesakhiwo se-basal plane dislocation ekusasazekeni kwe-single Shockley-type stacking fault ngexesha lokubola kwe-forward current ye-4H-SiC pin diodes. IJapan. J. Application. physics. 57, 04FR07 (2018).
UTahara, T., et al. Ubomi obufutshane bokuthwala izinto ezincinci kwi-epilayers ze-4H-SiC ezityebileyo kwi-nitrogen busetyenziselwa ukucinezela iimpazamo zokubeka izinto kwii-diode zePiN. J. Application. physics. 120, 115101 (2016).
UTahara, T. et al. Ukuxhomekeka koxinzelelo lwe-carrier olujojoweyo kwi-single Shockley stacking fault propagation kwi-4H-SiC PiN diodes. J. Application. Physics 123, 025707 (2018).
UMae, S., uTawara, T., uTsuchida, uH. kunye noKato, uM. Inkqubo yeMicroscopic FCA yokulinganisa ubomi bomthwali osombululwe ngobunzulu kwiSiC. UMae, S., uTawara, T., uTsuchida, uH. kunye noKato, uM. Inkqubo yeMicroscopic FCA yokulinganisa ubomi bomthwali osombululwe ngobunzulu kwiSiC.Mei, S., Tawara, T., Tsuchida, H. kunye noKato, M. Inkqubo yeMicroscopic yeFCA yoBume boMthwali oSombululwe ngoBunzulu kwiSilicon Carbide. Mae, S., Tawara, T., Tsuchida, H. & Kato, M. 用于SiC 中深度分辨载流子寿命测量的显微FCA 系统. Mae, S., Tawara, T., Tsuchida, H. & Kato, M. YeSiC ubunzulu obuphakathiUMei S., uTawara T., uTsuchida H. kunye noKato M. Inkqubo yeMicro-FCA yokulinganisa ubomi bokuthwala obuxazululwe ngobunzulu kwi-silicon carbide.IForam yesayensi ye-alma mater 924, 269–272 (2018).
UHirayama, T. et al. Ukusasazwa kobunzulu bexesha lobomi bomthwali kwiileya ze-epitaxial ze-4H-SiC ezijiyileyo kulinganiswe ngaphandle kokutshabalalisa kusetyenziswa isisombululo sexesha sokufunxwa kwe-carrier ekhululekileyo kunye nokukhanya okunqamlezileyo. Tshintshela kwisayensi. imitha. 91, 123902 (2020).
Ixesha lokuthumela: Novemba-06-2022