Khatello ea ho hasana ha liphoso ka har'a diode tsa 4H-SiC PiN ho sebelisa ho kenngoa ha proton ho felisa ho senyeha ha bipolar.

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4H-SiC e rekisitsoe e le thepa ea lisebelisoa tsa semiconductor ea matla.Leha ho le joalo, ho tšepahala ha nako e telele ea lisebelisoa tsa 4H-SiC ke tšitiso ho ts'ebeliso ea bona e pharaletseng, 'me bothata ba bohlokoa ka ho fetisisa ba ho tšepahala ha lisebelisoa tsa 4H-SiC ke ho senyeha ha maikutlo a ho ferekana kelellong.Ho senyeha hona ho bakoa ke phatlalatso e le 'ngoe ea Shockley stacking fault (1SSF) ea ho senyeha ha sefofane sa basal ka likristale tsa 4H-SiC.Mona, re sisinya mokhoa oa ho hatella katoloso ea 1SSF ka ho kenya li-proton ho li-wafers tsa 4H-SiC epitaxial.Li-diode tsa PiN tse entsoeng ka li-wafer tse kentsoeng proton li bonts'itse litšobotsi tse tšoanang tsa motlakase oa hajoale joalo ka diode ntle le ho kenngoa ha proton.Ka lehlakoreng le leng, katoloso ea 1SSF e hatelloa ka nepo ho diode ea PiN e kentsoeng ka proton.Kahoo, ho kenngoa ha li-proton ho li-wafers tsa 4H-SiC epitaxial ke mokhoa o atlehang oa ho hatella ho senyeha ha maikutlo a 4H-SiC matla a semiconductor ha u ntse u boloka ts'ebetso ea lisebelisoa.Sephetho sena se kenya letsoho ho nts'etsopele ea lisebelisoa tse tšepahalang tsa 4H-SiC.
Silicon carbide (SiC) e tsejoa ka ho pharaletseng e le thepa ea semiconductor bakeng sa lisebelisoa tse phahameng tsa matla, tse phahameng-frequency semiconductor tse ka sebetsang libakeng tse thata1.Ho na le li-polytypes tse ngata tsa SiC, tseo har'a tsona 4H-SiC e nang le lisebelisoa tse ntle tsa lisebelisoa tsa semiconductor tse kang ho tsamaea ha elektronike e phahameng le ho senyeha ho matla ha motlakase2.Li-wafers tsa 4H-SiC tse bophara ba lisenthimithara tse 6 hajoale li rekisoa ebile li sebelisetsoa ho hlahisa lisebelisoa tse ngata tsa matla a semiconductor3.Mekhoa ea ho hula likoloi tsa motlakase le literene li entsoe ka lisebelisoa tsa 4H-SiC4.5 tsa semiconductor tsa matla.Leha ho le joalo, lisebelisoa tsa 4H-SiC li ntse li na le mathata a nako e telele a ts'eptjoang a kang ho senyeha ha dielectric kapa ho tšepahala ha nako e khutšoanyane, 6,7 eo e 'ngoe ea lintlha tsa bohlokoa ka ho fetisisa tsa ho tšepahala ke ho senyeha ha bipolar2,8,9,10,11.Tšenyo ena ea ho ferekana kelellong e ile ea sibolloa lilemo tse fetang 20 tse fetileng mme esale e le bothata boqaping ba sesebelisoa sa SiC.
Ho senyeha ha Bipolar ho bakoa ke phoso e le 'ngoe ea Shockley stack (1SSF) ka likristale tsa 4H-SiC tse nang le li-basal plane dislocations (BPDs) tse phatlalatsoang ke recombination e ntlafalitsoeng ea dislocation glide (REDG)12,13,14,15,16,17,18,19.Ka hona, haeba katoloso ea BPD e hatelloa ho 1SSF, lisebelisoa tsa matla tsa 4H-SiC li ka etsoa ntle le ho senyeha ha bipolar.Ho tlalehiloe mekhoa e mengata ea ho hatella phatlalatso ea BPD, joalo ka BPD ho Thread Edge Dislocation (TED) phetoho 20,21,22,23,24.Likarolong tsa morao-rao tsa SiC epitaxial wafers, BPD e teng haholo-holo ka har'a substrate eseng ka har'a epitaxial layer ka lebaka la phetoho ea BPD ho TED nakong ea pele ea kholo ea epitaxial.Ka hona, bothata bo setseng ba ho senyeha ha bipolar ke ho ajoa ha BPD ka substrate 25,26,27.Ho kenngoa ha "motsoako o matlafatsang" pakeng tsa lera la ho hoholeha le substrate ho hlahisitsoe e le mokhoa o atlehang oa ho hatella ho atolosoa ha BPD ho substrate28, 29, 30, 31. Lera lena le eketsa monyetla oa ho kopanya li-electron-hole pair ho epitaxial layer le SiC substrate.Ho fokotsa palo ea li-electron-hole pairs ho fokotsa matla a ho khanna a REDG ho BPD ka substrate, kahoo motsoako o matlafatsang o ka hatella ho senyeha ha maikutlo a ho ferekana kelellong.Hoa lokela ho hlokomeloa hore ho kenngoa ha lera ho kenyelletsa litšenyehelo tse eketsehileng ha ho etsoa li-wafers, 'me ntle le ho kenngoa ha lera ho thata ho fokotsa palo ea lipara tsa elektronike-hole ka ho laola feela taolo ea bophelo bohle ba mojari.Ka hona, ho ntse ho e-na le tlhokahalo e matla ea ho hlahisa mekhoa e meng ea khatello ho finyella tekanyo e ntle pakeng tsa litšenyehelo tsa tlhahiso ea lisebelisoa le lihlahisoa.
Hobane ho atolosoa ha BPD ho 1SSF ho hloka ho sisinyeha ha karolo e itseng (PDs), ho penya PD ke mokhoa o ts'episang oa ho thibela ho senyeha ha maikutlo a ho ferekana kelellong.Le hoja PD e phunyeletsoa ka litšila tsa tšepe e tlalehiloe, li-FPD ho li-substrates tsa 4H-SiC li fumaneha hole ho feta 5 μm ho tloha holim'a lera la epitaxial.Holim'a moo, kaha coefficient ea phallo ea tšepe efe kapa efe ho SiC e nyane haholo, ho thata hore lits'ila tsa tšepe li kenelle ka har'a substrate34.Ka lebaka la bongata bo boholo ba athomo ea tšepe, ho kenngoa ha ion ea tšepe le hona ho thata.Ka lehlakoreng le leng, tabeng ea haedrojene, ntho e bobebe ka ho fetisisa, li-ion (protons) li ka kenngoa ho 4H-SiC ho ea botebong ba ho feta 10 µm ho sebelisa accelerator ea MeV-class.Ka hona, haeba ho kenngoa ha proton ho ama PD pinning, joale e ka sebelisoa ho hatella phatlalatso ea BPD ka har'a substrate.Leha ho le joalo, ho kenngoa ha proton ho ka senya 4H-SiC mme ho fella ka ho fokotsa ts'ebetso ea lisebelisoa37,38,39,40.
E le ho hlōla ho senyeha ha sesebelisoa ka lebaka la ho kenngoa ha proton, ho sebelisoa ha mocheso o phahameng oa mocheso ho lokisa tšenyo, e tšoanang le mokhoa oa annealing o atisang ho sebelisoa ka mor'a ho kenngoa ha ion ea ho amohela mochine oa mochine1, 40, 41, 42. Le hoja ion mass spectrometry ea bobeli (SIMS)43 e na le tlalehile hydrogen diffusion ka lebaka la annealing phahameng-thempereichara, ho ka etsahala hore feela segokanyipalo sa liathomo tsa haedrojene haufi le FD ha hoa lekana ho lemoha pinning ea PR sebelisa SIMS.Ka hona, thutong ena, re kentse li-proton ho li-wafers tsa 4H-SiC epitaxial pele ho ts'ebetso ea ho etsa lisebelisoa, ho kenyelletsa le mocheso o phahameng oa mocheso.Re sebelisitse li-diode tsa PiN joalo ka meaho ea lisebelisoa tsa liteko mme ra li etsa ho li-wafers tse kentsoeng ka proton 4H-SiC epitaxial.Ka mor'a moo re ile ra hlokomela litšobotsi tsa volt-ampere ho ithuta ho senyeha ha ts'ebetso ea sesebelisoa ka lebaka la ente ea proton.Ka mor'a moo, re ile ra bona katoloso ea 1SSF litšoantšong tsa electroluminescence (EL) ka mor'a ho sebelisa motlakase oa motlakase ho diode ea PiN.Qetellong, re netefalitse phello ea ente ea proton khatellong ea katoloso ea 1SSF.
Ka feiga.Setšoantšo sa 1 se bonts'a litšobotsi tsa hona joale tsa motlakase (CVCs) tsa PiN diode ka mocheso oa kamore libakeng tse nang le proton le ntle le ho kenngoa pele ho pulsed hona joale.PiN diode tse nang le ente ea proton li bonts'a litšobotsi tsa tokiso tse ts'oanang le li-diode ntle le ente ea proton, leha litšobotsi tsa IV li arolelanoa lipakeng tsa diode.Ho bontša phapang pakeng tsa maemo a ente, re ile ra rera maqhubu a motlakase ka lebelo la pele la 2.5 A / cm2 (e lumellanang le 100 mA) e le palo ea lipalo-palo joalokaha ho bontšitsoe setšoantšong sa 2. Lekhalo le lekanyelitsoeng ke kabo e tloaelehileng le eona e emetsoe. ka mola o matheba.mola.Joalo ka ha ho bonoa litlhorong tsa li-curve, khanyetso ea ho hanyetsa e eketseha hanyane ho litekanyetso tsa proton tsa 1014 le 1016 cm-2, ha diode ea PiN e nang le tekanyo ea proton ea 1012 cm-2 e bonts'a litšobotsi tse batlang li tšoana le ntle le ho kenngoa ha proton. .Re ile ra boela ra kenya proton ka mor'a ho etsoa ha li-PiN diode tse neng li sa bontše electroluminescence e tšoanang ka lebaka la tšenyo e bakiloeng ke ho kenngoa ha proton joalokaha ho bontšitsoe ho Setšoantšo sa S1 joalokaha ho hlalositsoe lithutong tse fetileng37,38,39.Ka hona, annealing ka 1600 ° C ka mor'a ho kenngoa ha Al ion ke mokhoa o hlokahalang oa ho etsa lisebelisoa ho kenya mochine oa Alcceptor, o ka lokisang tšenyo e bakiloeng ke ho kenngoa ha proton, e leng se etsang hore li-CVC li tšoane pakeng tsa proton PiN diode tse kentsoeng le tse sa kenngoeng. .Maqhubu a morao-rao a morao-rao ho -5 V a boetse a hlahisoa ho Setšoantšo sa S2, ha ho na phapang e khōlō pakeng tsa diode tse nang le ente ea proton le ntle le eona.
Litšobotsi tsa Volt-ampere tsa diode tsa PiN tse nang le li-proton tse kentsoeng le ntle le mocheso oa kamore.Tšōmo e bontša tekanyo ea protons.
Maqhubu a motlakase ka ho toba 2.5 A/cm2 bakeng sa diode tsa PiN tse nang le li-proton tse kentsoeng le tse sa kenngoeng.Mohala o nang le matheba o lumellana le kabo e tloaelehileng.
Ka feiga.3 e bonts'a setšoantšo sa EL sa diode ea PiN e nang le boima ba hona joale ba 25 A / cm2 ka mor'a motlakase.Pele o sebelisa mojaro oa hona joale oa pulsed, libaka tse lefifi tsa diode ha lia ka tsa hlokomeloa, joalokaha ho bontšitsoe setšoantšong sa 3. C2.Leha ho le joalo, joalokaha ho bontšitsoe feiga.3a, ka har'a diode ea PiN ntle le ho kenngoa ha proton, libaka tse 'maloa tse mebala e lefifi tse nang le mapheo a khanyang li ile tsa bonoa ka mor'a ho sebelisa motlakase oa motlakase.Libaka tse joalo tse lefifi tse bōpehileng joaloka molamu li bonoa litšoantšong tsa EL bakeng sa 1SSF e tlohang ho BPD ho substrate28,29.Ho e-na le hoo, liphoso tse ling tse atolositsoeng tsa stacking li ile tsa hlokomeloa ka li-diode tsa PiN tse nang le li-proton tse kentsoeng, joalokaha ho bontšitsoe setšoantšong sa 3b-d.Re sebelisa X-ray topography, re netefalitse boteng ba PRs tse ka tlohang ho BPD ho ea substrate sebakeng sa li-contacts tsa PiN diode ntle le ente ea proton (Setšoantšo sa 4: setšoantšo sena ntle le ho tlosa electrode e ka holimo (setšoantšo, PR). tlas'a li-electrode ha li bonahale). Ka hona, sebaka se lefifi setšoantšong sa EL se lumellana le 1SSF BPD e atolositsoeng karolong e ka tlaase. Litšoantšo tsa EL tsa li-piN diode tse ling tse tletseng li bontšoa ho Figure 1 le 2. Videos S3-S6 with and without extended libaka tse lefifi (litšoantšo tsa EL tse fapaneng tsa nako ea diode tsa PiN ntle le ente ea proton le ho kenngoa ho 1014 cm-2) li boetse li bontšoa ho Boitsebiso bo Tlatselletsang.
EL litšoantšo tsa PiN diode ho 25 A/cm2 ka mor'a lihora tse 2 tsa khatello ea motlakase (a) ntle le ho kenngoa ha proton le ka litekanyetso tse kenngoeng tsa (b) 1012 cm-2, (c) 1014 cm-2 le (d) 1016 cm-2 protons.
Re balile boima ba 1SSF e atolositsoeng ka ho bala libaka tse lefifi tse nang le likhahla tse khanyang ho li-PiN diode tse tharo bakeng sa boemo bo bong le bo bong, joalokaha ho bontšitsoe setšoantšong sa 5. Boima ba 1SSF bo atolositsoeng bo fokotseha ka tekanyo ea proton e ntseng e eketseha, esita le ka tekanyo ea 1012 cm-2, boima ba 1SSF bo atolositsoeng bo tlase haholo ho feta ka piN diode e sa kenngoeng.
Ho eketseha ha sekhahla sa li-diode tsa SF PiN tse kenngoeng le ntle le ho kenngoa ha proton ka mor'a ho jara ka pulsed current (sebaka se seng le se seng se kenyelelitse li-diode tse tharo tse laetsoeng).
Ho khutsufatsa nako ea bophelo ba motho ea tsamaisang thepa ho boetse ho ama khatello ea katoloso, 'me ente ea proton e fokotsa nako ea bophelo ea mojari32,36.Re hlokometse nako ea bophelo ba motho ea tsamaisang thepa ka har'a epitaxial layer ea 60 µm e teteaneng e nang le li-proton tse kentsoeng tsa 1014 cm-2.Ho tloha nakong ea pele ea bophelo ba mojari, le hoja ho kenngoa ho fokotsa boleng ho ~ 10%, annealing e latelang e khutlisetsa ~ 50%, joalokaha ho bontšitsoe setšoantšong sa S7.Ka hona, nako ea bophelo ea mojari, e fokotsehileng ka lebaka la ho kenngoa ha proton, e tsosolosoa ka ho kenngoa ha mocheso o phahameng.Le hoja phokotso ea 50% ea bophelo ba bajari e boetse e hatella ho ata ha liphoso tsa stacking, litšoaneleho tsa I-V, tseo ka tloaelo li itšetlehileng ka bophelo ba mojari, li bontša feela phapang e nyenyane pakeng tsa diode tse kentsoeng le tse sa kenngoeng.Ka hona, re lumela hore PD anchoring e bapala karolo ho thibela katoloso ea 1SSF.
Le hoja SIMS e sa ka ea bona hydrogen ka mor'a ho kenngoa ha 1600 ° C, joalokaha ho tlalehiloe liphuputsong tse fetileng, re hlokometse phello ea ho kenngoa ha proton ho hatelloa ha 1SSF katoloso, joalokaha ho bontšitsoe litšoantšong 1 le 4. 3, 4. Ka hona, re lumela hore PD e tšehelitsoe ke liathomo tsa haedrojene tse nang le boima bo ka tlase ho moeli oa ho lemoha oa SIMS (2 × 1016 cm-3) kapa bofokoli ba ntlha bo bakoang ke ho kenngoa.Hoa lokela ho hlokomeloa hore ha re e-s'o tiise keketseho ea khanyetso ea mmuso ka lebaka la bolelele ba 1SSF ka mor'a hore ho be le mojaro oa hona joale.Sena se ka ba ka lebaka la mabitso a sa phethahalang a ohmic a entsoeng ho sebelisoa ts'ebetso ea rona, e tla felisoa haufinyane.
Qetellong, re thehile mokhoa oa ho tima bakeng sa ho atolosa BPD ho 1SSF ka diode tsa 4H-SiC PiN re sebelisa ho kenngoa ha proton pele ho etsoa lisebelisoa.Ho senyeha ha tšobotsi ea I-V nakong ea ho kenngoa ha proton ha ho letho, haholo-holo ka tekanyo ea proton ea 1012 cm-2, empa phello ea ho hatella katoloso ea 1SSF e bohlokoa.Leha thutong ena re thehile diode tse 10 µm tse botenya tsa PiN tse kentsoeng proton ho isa botebong ba 10 µm, ho ntse ho khonahala ho ntlafatsa maemo a ho kengoa le ho a sebelisa ho etsa mefuta e meng ea lisebelisoa tsa 4H-SiC.Litšenyehelo tse eketsehileng bakeng sa lisebelisoa tsa lisebelisoa nakong ea ho kenngoa ha proton li lokela ho nkoa, empa li tla tšoana le tsa ho kenngoa ha aluminium ion, e leng mokhoa o ka sehloohong oa ho etsa lisebelisoa tsa matla a 4H-SiC.Kahoo, ho kenngoa ha proton pele ho ts'ebetso ea lisebelisoa ke mokhoa o ka khonehang oa ho etsa lisebelisoa tsa matla a bipolar tsa 4H-SiC ntle le ho senyeha.
Sephaphatha sa 4-inch n-type 4H-SiC se nang le botenya ba epitaxial ea 10 µm le "donor doping concentration" ea 1 × 1016 cm–3 e sebelisitsoe e le sampuli.Pele o sebetsana le sesebelisoa, li-ion tsa H + li ne li kenngoa ka poleiti ka matla a ho potlakisa a 0.95 MeV mocheso oa kamore ho ea botebong ba 10 μm ka lehlakoreng le tloaelehileng ho ea holim'a poleiti.Nakong ea ho kenngoa ha proton, mask holim'a poleiti e ne e sebelisoa, 'me poleiti e ne e e-na le likarolo tse se nang le tekanyo ea proton ea 1012, 1014, kapa 1016 cm-2.Ka mor'a moo, li-ion tse nang le litekanyo tsa proton tsa 1020 le 1017 cm-3 li ile tsa kenngoa holim'a sephaphatha kaofela ho ea botebong ba 0-0.2 µm le 0.2-0.5 µm ho tloha holimo, 'me ea lateloa ke annealing ka 1600°C ho etsa cap cap to carbon. theha ap layer.- mofuta.Ka mor'a moo, lehlakoreng le ka morao la Ni contact le ile la behoa ka lehlakoreng la substrate, ha ho kopana le mahlakoreng a mahlakoreng a 2.0 × 2.0 mm a nang le sebopeho sa Ti / Al se ka pele se entsoeng ke photolithography le mokhoa oa peel o kenngoa ka lehlakoreng la epitaxial layer.Qetellong, annealing ea ho kopana e etsoa ka mocheso oa 700 ° C.Kamora ho seha sephaphatha hore e be li-chips, re ile ra etsa sebopeho sa khatello ea maikutlo le ts'ebeliso.
Litšobotsi tsa I-V tsa li-diode tsa PiN tse entsoeng li ile tsa bonoa ho sebelisoa HP4155B semiconductor parameter analyzer.Joaloka khatello ea motlakase, 10-millisecond pulsed current ea 212.5 A / cm2 e ile ea hlahisoa ka lihora tsa 2 ka makhetlo a 10 pulses / sec.Ha re khetha sekhahla se tlase kapa khafetsa, ha rea ​​ka ra bona katoloso ea 1SSF esita le ka har'a diode ea PiN ntle le ente ea proton.Nakong ea matla a motlakase a sebelisoang, mocheso oa PiN diode o pota-potile 70 ° C ntle le ho futhumatsa ka boomo, joalokaha ho bontšoa ho Setšoantšo sa S8.Litšoantšo tsa electroluminescent li ile tsa fumanoa pele le ka mor'a khatello ea motlakase ka bongata ba hona joale ba 25 A / cm2.Synchrotron reflection dlong incidence X-ray topography using monochromatic X-ray beam (λ = 0.15 nm) ho Aichi Synchrotron Radiation Center, ag vector in BL8S2 ke -1-128 kapa 11-28 (sheba ref. 44 bakeng sa lintlha tse ling) .).
Maqhubu a motlakase ka sekhahla sa pele sa 2.5 A / cm2 se ntšoa ka nako ea 0.5 V ho feiga.2 ho latela CVC ea boemo bo bong le bo bong ba diode ea PiN.Ho tsoa ho boleng bo tloaelehileng ba Vave ea khatello ea maikutlo le ho kheloha ho tloaelehileng σ ea khatello ea maikutlo, re rera lekhalo le tloaelehileng la kabo ka mokhoa oa mola o nang le matheba setšoantšong sa 2 re sebelisa equation e latelang:
Werner, MR & Fahrner, Tlhahlobo ea WR ka thepa, li-microsensors, litsamaiso le lisebelisoa bakeng sa lisebelisoa tse phahameng tsa mocheso le tikoloho e thata. Werner, MR & Fahrner, Tlhahlobo ea WR ka thepa, li-microsensors, litsamaiso le lisebelisoa bakeng sa lisebelisoa tse phahameng tsa mocheso le tikoloho e thata.Werner, MR le Farner, WR Kakaretso ea lisebelisoa, li-microsensors, litsamaiso le lisebelisoa bakeng sa lits'ebetso tse maemong a phahameng a mocheso le maemo a thata. Werner, MR & Fahrner, WR 对用于高温和恶劣环境应用的材料、微传感器、系统和设备的评论。 Werner, MR & Fahrner, WR Tlhahlobo ea lisebelisoa, li-microsensors, litsamaiso le lisebelisoa bakeng sa mocheso o phahameng le lits'ebetso tse mpe tsa tikoloho.Werner, MR le Farner, WR Kakaretso ea lisebelisoa, li-microsensors, litsamaiso le lisebelisoa bakeng sa lits'ebetso ka mocheso o phahameng le maemo a thata.IEEE Trans.Lisebelisoa tsa elektronike tsa indasteri.48, 249-257 (2001).
Kimoto, T. & Cooper, JA Metheo ea Theknoloji ea Silicon Carbide Theknoloji ea Silicon Carbide: Khōlo, Boitšoaro, Lisebelisoa le Likopo Vol. Kimoto, T. & Cooper, JA Metheo ea Theknoloji ea Silicon Carbide Theknoloji ea Silicon Carbide: Khōlo, Boitšoaro, Lisebelisoa le Likopo Vol.Kimoto, T. le Cooper, JA Basics of Silicon Carbide Technology Basics of Silicon Carbide Technology: Khōlo, Litšobotsi, Lisebelisoa le Likopo Vol. Kimoto, T. & Cooper, JA 碳化硅技术基础碳化硅技术基础:增长、表征、设备和应用卷。 Kimoto, T. & Cooper, JA Carbon化silicon motheo oa theknoloji ea Carbon化silicon motheo oa theknoloji: kgolo, tlhaloso, lisebelisoa le boholo ba kopo.Kimoto, T. le Cooper, J. Lintho tsa Motheo tsa Theknoloji ea Silicon Carbide Theknoloji ea Silicon Carbide: Khōlo, Litšobotsi, Lisebelisoa le Likopo Vol.252 (Wiley Singapore Pte Ltd, 2014).
Veliadis, V. Khoebo e Khōlō ea SiC: Boemo ba Boemo le Litšitiso tse Lokelang ho Hlōloa.alma mater.saense.Forum 1062, 125–130 (2022).
Broughton, J., Smet, V., Tummala, RR & Joshi, YK Tlhahlobo ea theknoloji ea ho paka ka mocheso bakeng sa lisebelisoa tsa motlakase tsa likoloi bakeng sa merero ea ho hula. Broughton, J., Smet, V., Tummala, RR & Joshi, YK Tlhahlobo ea theknoloji ea ho paka ka mocheso bakeng sa lisebelisoa tsa motlakase tsa likoloi bakeng sa merero ea ho hula.Broughton, J., Smet, V., Tummala, RR le Joshi, YK Kakaretso ea theknoloji ea ho paka ka mocheso bakeng sa lisebelisoa tsa motlakase tsa likoloi bakeng sa merero ea ho hula. Broughton, J., Smet, V., Tummala, RR & Joshi, YK 用于牵引目的汽车电力电子热封装技术的回顾. Broughton, J., Smet, V., Tummala, RR & Joshi, YKBroughton, J., Smet, V., Tummala, RR le Joshi, YK Kakaretso ea theknoloji ea ho paka ka mocheso bakeng sa lisebelisoa tsa motlakase tsa motlakase bakeng sa merero ea ho hula.J. Elektrone.Sephutheloana.tebelo.ASME 140, 1-11 (2018).
Sato, K., Kato, H. & Fukushima, T. Nts'etsopele ea SiC e sebelisitsoeng tsamaiso ea tsamaiso bakeng sa literene tse lebelo tse phahameng tsa Shinkansen tsa moloko o latelang. Sato, K., Kato, H. & Fukushima, T. Nts'etsopele ea SiC e sebelisitsoeng tsamaiso ea tsamaiso bakeng sa literene tse lebelo tse phahameng tsa Shinkansen tsa moloko o latelang.Sato K., Kato H. le Fukushima T. Nts'etsopele ea SiC traction system e sebelisoang bakeng sa literene tsa Shinkansen tsa lebelo le holimo.Sato K., Kato H. le Fukushima T. Ts'ebetso ea Ts'ebetso ea Ts'ebetso ea Ts'ebetso bakeng sa Likopo tsa SiC bakeng sa Literene tsa Shinkansen tsa Next Generation High-Speed.Sehlomathiso IEEJ J. Ind. 9, 453–459 (2020).
Senzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. Mathata a ho hlokomela lisebelisoa tsa motlakase tsa SiC tse tšepahalang haholo: Ho tloha boemong ba hona joale le litaba tsa li-wafers tsa SiC. Senzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. Mathata a ho hlokomela lisebelisoa tsa motlakase tsa SiC tse tšepahalang haholo: Ho tloha boemong ba hona joale le litaba tsa li-wafers tsa SiC.Senzaki, J., Hayashi, S., Yonezawa, Y. le Okumura, H. Mathata a ts'ebetsong ea lisebelisoa tsa matla tsa SiC tse ka tšeptjoang haholo: ho qala ho tloha boemong ba hona joale le bothata ba li-wafer SiC. Senzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. 实现高可靠性SiC 功率器件的挑战:从SiC 晶圆的现状和问题來. Senzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. Phephetso ea ho fumana ts'epo e phahameng ea lisebelisoa tsa motlakase tsa SiC: ho tloha ho SiC 晶圆的电视和问题设计。Senzaki J, Hayashi S, Yonezawa Y. le Okumura H. Mathata ho nts'etsopele ea lisebelisoa tsa matla tse phahameng tse ka tšeptjoang tse thehiloeng ho silicon carbide: tlhahlobo ea boemo le mathata a amanang le li-wafers tsa silicon carbide.Sebokeng sa Machaba sa 2018 sa IEEE sa Fisiks ea Tšepahalang (IRPS).(Senzaki, J. et al. ed.) 3B.3-1-3B.3-6 (IEEE, 2018).
Kim, D. & Sung, W. E ntlafalitse mahlahahlaha a nako e khuts'oane bakeng sa 1.2kV 4H-SiC MOSFET ka ho sebelisa P-well e tebileng e kenngoeng ke mochine oa ho kenngoa. Kim, D. & Sung, W. E ntlafalitse mahlahahlaha a nako e khuts'oane bakeng sa 1.2kV 4H-SiC MOSFET ka ho sebelisa P-well e tebileng e kenngoeng ke mochine oa ho kenngoa.Kim, D. le Sung, V. E ntlafalitse tšireletso ea potoloho e khutšoanyane bakeng sa 1.2 kV 4H-SiC MOSFET ka ho sebelisa P-well e tebileng e kenngoa ts'ebetsong ka ho kenngoa ha mocha. Kim, D. & Sung, W. 使用通过沟道注入实现的深P 阱提高了1.2kV 4H-SiC MOSFET 的短路耐用性。 Kim, D. & Sung, W. P 阱提高 了1.2kV 4H-SiC MOSFETKim, D. le Sung, V. E ntlafalitse mamello ea potoloho e khutšoanyane ea 1.2 kV 4H-SiC MOSFETs ka ho sebelisa liliba tse tebileng tsa P ka ho kenngoa ha mocha.IEEE Lisebelisoa tsa Elektronike Lett.42, 1822–1825 (2021).
Skowronski M. et al.Tšisinyeho e ntlafalitsoeng ea bofokoli ho li-pn diode tsa 4H-SiC tse lebeletsoeng pele.J. Kopo.fisiks.92, 4699–4704 (2002).
Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, LB Dislocation conversion in 4H silicon carbide epitaxy. Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, LB Dislocation conversion in 4H silicon carbide epitaxy.Ha S., Meszkowski P., Skowronski M. le Rowland LB Dislocation transformation during 4H silicon carbide epitaxy. Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, LB 4H 碳化硅外延中的位错转换。 Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, LB 4H Ha, S., Meszkowski, P., Skowronski, M. & Rowland, LBPhetoho ea dislocation 4H ho silicon carbide epitaxy.J. Crystal.Khōlo 244, 257-266 (2002).
Skowronski, M. & Ha, S. Ho senyeha ha lisebelisoa tsa bipolar tse nang le hexagonal silicon-carbide. Skowronski, M. & Ha, S. Ho senyeha ha lisebelisoa tsa bipolar tse nang le hexagonal silicon-carbide.Skowronski M. le Ha S. Ho senyeha ha lisebelisoa tsa hexagonal bipolar tse thehiloeng ho silicon carbide. Skowronski, M. & Ha, S. 六方碳化硅基双极器件的降解。 Skowronski M. & Ha S.Skowronski M. le Ha S. Ho senyeha ha lisebelisoa tsa hexagonal bipolar tse thehiloeng ho silicon carbide.J. Kopo.fisiks 99, 011101 (2006).
Agarwal, A., Fatima, H., Haney, S. & Ryu, S.-H. Agarwal, A., Fatima, H., Haney, S. & Ryu, S.-H.Agarwal A., Fatima H., Heini S. le Ryu S.-H. Agarwal, A., Fatima, H., Haney, S. & Ryu, S.-H. Agarwal, A., Fatima, H., Haney, S. & Ryu, S.-H.Agarwal A., Fatima H., Heini S. le Ryu S.-H.Mochine o mocha oa ho senya bakeng sa li-MOSFET tsa matla a phahameng a SiC.IEEE Lisebelisoa tsa Elektronike Lett.28, 587–589 (2007).
Caldwell, JD, Stahlbush, RE, Ancona, MG, Glembocki, OJ & Hobart, KD Ka matla a ho khanna bakeng sa ts'ebetso ea phoso e bakoang ke ho kopanya hape ka 4H-SiC. Caldwell, JD, Stahlbush, RE, Ancona, MG, Glembocki, OJ & Hobart, KD Ka matla a ho khanna bakeng sa ts'ebetso ea phoso e bakoang ke ho kopanya hape ho 4H-SiC.Caldwell, JD, Stalbush, RE, Ancona, MG, Glemboki, OJ, le Hobart, KD Ka lebaka la ts'ebetso ea recombination-induced stacking fault motion ho 4H-SiC. Caldwell, JD, Stahlbush, RE, Ancona, MG, Glembocki, OJ & Hobart, KD 关于4H-SiC 中复合引起的层错运动的驱动力。 Caldwell, JD, Stahlbush, RE, Ancona, MG, Glembocki, OJ & Hobart, KDCaldwell, JD, Stalbush, RE, Ancona, MG, Glemboki, OJ, le Hobart, KD, Ka lebaka la ts'ebetso ea recombination-induced stacking fault motion ho 4H-SiC.J. Kopo.fisiks.108, 044503 (2010).
Iijima, A. & Kimoto, T. Moetso oa matla oa elektronike bakeng sa sebopeho se le seng sa phoso sa Shockley stacking ka likristale tsa 4H-SiC. Iijima, A. & Kimoto, T. Moetso oa matla oa elektronike bakeng sa sebopeho se le seng sa phoso sa Shockley stacking ka likristale tsa 4H-SiC.Iijima, A. le Kimoto, T. Electron-energy model ea ho thehoa ha bokooa bo le bong ba Shockley e pakang ka likristale tsa 4H-SiC. Iijima, A. & Kimoto, T. 4H-SiC 晶体中单Shockley 堆垛层错形成的电子能量模型. Iijima, A. & Kimoto, T. Moetso oa matla oa elektronike oa sebopeho se le seng sa Shockley stacking ka kristale ea 4H-SiC.Iijima, A. le Kimoto, T. Electron-energy model ea ho thehoa ha sekoli se le seng sa Shockley ka likristale tsa 4H-SiC.J. Kopo.fisiks 126, 105703 (2019).
Iijima, A. & Kimoto, T. Khakanyo ea boemo bo boima bakeng sa ho atolosa / ho fokotsa liphoso tse le 'ngoe tsa Shockley stacking ho 4H-SiC PiN diode. Iijima, A. & Kimoto, T. Khakanyo ea boemo bo boima bakeng sa ho atolosa / ho fokotsa liphoso tse le 'ngoe tsa Shockley stacking ho 4H-SiC PiN diode.Iijima, A. le Kimoto, T. Khakanyo ea boemo bo mahlonoko bakeng sa ho atolosoa / ho hatelloa ha mefokolo e le 'ngoe ea Shockley ea ho paka ka 4H-SiC PiN-diode. Iijima, A. & Kimoto, T. 估计4H-SiC PiN 二极管中单个Shockley 堆垛层错膨胀/收缩的临界条件。 Iijima, A. & Kimoto, T. Khakanyo ea boemo bo le bong ba Shockley stacking layer katoloso/contraction ka diode 4H-SiC PiN.Iijima, A. le Kimoto, T. Khakanyo ea maemo a bohlokoa bakeng sa ho atolosoa / khatello ea sekoli se le seng sa ho paka Shockley ka 4H-SiC PiN-diodes.tšebeliso ea fisiks Wright.116, 092105 (2020).
Mannen, Y., Shimada, K., Asada, K. & Ohtani, N. Quantum well action model bakeng sa ho thehoa ha phoso e le 'ngoe ea Shockley stacking ka kristale ea 4H-SiC tlas'a maemo a sa tsitsang. Mannen, Y., Shimada, K., Asada, K. & Ohtani, N. Quantum well action model bakeng sa ho thehoa ha phoso e le 'ngoe ea Shockley stacking ka kristale ea 4H-SiC tlas'a maemo a sa tsitsang.Mannen Y., Shimada K., Asada K., le Otani N. Mohlala oa seliba sa quantum bakeng sa ho thehoa ha phoso e le 'ngoe ea Shockley ka kristale ea 4H-SiC tlas'a maemo a sa tsitsang.Mannen Y., Shimada K., Asada K. le Otani N. Quantum mohlala oa ho sebelisana hantle bakeng sa ho thehoa ha liphoso tse le 'ngoe tsa Shockley stacking ka likristale tsa 4H-SiC tlas'a maemo a sa tsitsang.J. Kopo.fisiks.125, 085705 (2019).
Galeckas, A., Linnros, J. & Pirouz, P. Recombination-induced stacking liphoso: Bopaki ba mochine o akaretsang ka SiC ea hexagonal. Galeckas, A., Linnros, J. & Pirouz, P. Recombination-induced stacking liphoso: Bopaki ba mochine o akaretsang ka SiC ea hexagonal.Galeckas, A., Linnros, J. le Pirouz, P. Mefokolo ea Packing e Bakiloeng ke Recombination: Bopaki ba Mokhoa o Tloaelehileng oa Hexagonal SiC. Galeckas, A., Linnros, J. & Pirouz, P. 复合诱导的堆垛层错:六方SiC 中一般机制的证据。 Galeckas, A., Linnros, J. & Pirouz, P. Bopaki ba mochine o akaretsang oa composite induction stacking layer: 六方SiC.Galeckas, A., Linnros, J. le Pirouz, P. Mefokolo ea Packing e Bakiloeng ke Recombination: Bopaki ba Mokhoa o Tloaelehileng oa Hexagonal SiC.fisiks Moruti Wright.96, 025502 (2006).
Ishikawa, Y., Sudo, M., Yao, Y.-Z., Sugawara, Y. & Kato, M. Katoloso ea phoso e le 'ngoe ea Shockley stacking ka 4H-SiC (11 2 ¯0) epitaxial layer e bakoang ke electron mahlaseli a mahlaseli.Ishikawa , Y. , M. Sudo , Y.-Z beam irradiation.Ishikawa, Y., Sudo M., Y.-Z Psychology.Lebokose, Ю., M.Судо, Y.-Z Chem., J. Chem., 123, 225101 (2018).
Kato, M., Katahira, S., Ichikawa, Y., Harada, S. & Kimoto, T. Tlhokomelo ea recombination ea bajari ka liphoso tse le 'ngoe tsa Shockley stacking le ho arohana ha karolo ho 4H-SiC. Kato, M., Katahira, S., Ichikawa, Y., Harada, S. & Kimoto, T. Tlhokomelo ea recombination ea bajari ka liphoso tse le 'ngoe tsa Shockley stacking le ho arohana ha karolo ho 4H-SiC.Kato M., Katahira S., Itikawa Y., Harada S. le Kimoto T. Tlhokomelo ea Ts'ebetso ea Ts'ebetso ea Ts'ebetso ea Ts'ebetso ea Lits'oants'o tsa Shockley e le 'Ngoe le Phapang ea Karolo ka 4H-SiC. Kato, M., Katahira, S., Ichikawa, Y., Harada, S. & Kimoto, T. 单Shockley 堆垛层错和4H-SiC 部分位错中载流子复合的观察. Kato, M., Katahira, S., Ichikawa, Y., Harada, S. & Kimoto, T. 单Shockley stacking stacking和4H-SiC partial 位错中载流子去生的可以。Kato M., Katahira S., Itikawa Y., Harada S. le Kimoto T. Tlhokomelo ea Ts'ebetso ea Ts'ebetso ea Ts'ebetso ea Ts'ebetso ea Lits'oants'o tsa Shockley e le 'Ngoe le Phapang ea Karolo ka 4H-SiC.J. Kopo.fisiks 124, 095702 (2018).
Kimoto, T. & Watanabe, H. Defect engineering ho theknoloji ea SiC bakeng sa lisebelisoa tsa matla a phahameng a matla. Kimoto, T. & Watanabe, H. Defect engineering ho theknoloji ea SiC bakeng sa lisebelisoa tsa matla a phahameng a matla.Kimoto, T. le Watanabe, H. Tsoelo-pele ea bofokoli ho theknoloji ea SiC bakeng sa lisebelisoa tsa matla a phahameng a matla. Kimoto, T. & Watanabe, H. 用于高压功率器件的SiC 技术中的缺陷工程。 Kimoto, T. & Watanabe, H. Defect engineering ho theknoloji ea SiC bakeng sa lisebelisoa tsa matla a phahameng a matla.Kimoto, T. le Watanabe, H. Tsoelo-pele ea bofokoli ho theknoloji ea SiC bakeng sa lisebelisoa tsa matla a phahameng a matla.tšebeliso ea fisiks Express 13, 120101 (2020).
Zhang, Z. & Sudarshan, TS Basal plane dislocation-free epitaxy of silicon carbide. Zhang, Z. & Sudarshan, TS Basal plane dislocation-free epitaxy of silicon carbide.Zhang Z. le Sudarshan TS Dislocation-free epitaxy ea silicon carbide ka sefofane sa basal. Zhang, Z. & Sudarshan, TS 碳化硅基面无位错外延。 Zhang, Z. & Sudarshan, TSZhang Z. le Sudarshan TS Dislocation-free epitaxy ea silicon carbide basal basal.polelo.fisiks.Wright.87, 151913 (2005).
Zhang, Z., Moulton, E. & Sudarshan, TS Mechanism ea ho felisa ho tlosoa ha sefofane sa basal lifiliming tse tšesaane tsa SiC ka epitaxy holim'a substrate e kentsoeng. Zhang, Z., Moulton, E. & Sudarshan, TS Mechanism ea ho felisa ho tlosoa ha sefofane sa basal lifiliming tse tšesaane tsa SiC ka epitaxy holim'a substrate e kentsoeng.Zhang Z., Moulton E. le Sudarshan TS Mechanism ea ho felisa ho kheloha ha sefofane ka har'a lifilimi tse tšesaane tsa SiC ka epitaxy holim'a substrate e kentsoeng. Zhang, Z., Moulton, E. & Sudarshan, TS 通过在蚀刻衬底上外延消除SiC 薄膜中基面位错的机制。 Zhang, Z., Moulton, E. & Sudarshan, TS Mokhoa oa ho felisa filimi e tšesaane ea SiC ka ho kenya substrate.Zhang Z., Moulton E. le Sudarshan TS Mechanism ea ho felisa ho kheloha ha sefofane ka har'a lifilimi tse tšesaane tsa SiC ka epitaxy ho li-substrates tse kentsoeng.tšebeliso ea fisiks Wright.89, 081910 (2006).
Shtalbush RE et al.Tšitiso ea kholo e lebisa ho fokotseha ha ho senyeha ha sefofane sa basal nakong ea 4H-SiC epitaxy.polelo.fisiks.Wright.94, 041916 (2009).
Zhang, X. & Tsuchida, H. Phetoho ea li-basal plane dislocations to threading edge dislocations in 4H-SiC epilayers by high temperature annealing. Zhang, X. & Tsuchida, H. Phetoho ea li-basal plane dislocations to threading edge dislocations in 4H-SiC epilayers by high temperature annealing.Zhang, X. le Tsuchida, H. Phetoho ea li-basal plane dislocations into threading edge dislocations ho 4H-SiC epitaxial layers ka mocheso o phahameng oa annealing. Zhang, X. & Tsuchida, H. 通过高温退火将4H-SiC 外延层中的基面位错转化為螺纹刃位错. Zhang, X. & Tsuchida, H. 通过高温退火将4H-SiCZhang, X. le Tsuchida, H. Phetoho ea ho kheloha ha sefofane sa motheo ho ea ho li-filament edge dislocations ho 4H-SiC epitaxial layers ka mocheso o phahameng oa annealing.J. Kopo.fisiks.111, 123512 (2012).
Pina, H. & Sudarshan, TS Basal plane dislocation conversion haufi le epilayer / substrate interface ka kgolo ea epitaxial ea 4 ° off-axis 4H-SiC. Pina, H. & Sudarshan, TS Basal plane dislocation conversion haufi le epilayer / substrate interface ka kgolo ea epitaxial ea 4 ° off-axis 4H-SiC.Pina, H. le Sudarshan, TS Phetoho ea ho senyeha ha sefofane sa basal haufi le epitaxial layer / substrate interface nakong ea khōlo ea off-axis epitaxial ea 4H-SiC. Song, H. & Sudarshan, TS 在4° 离轴4H-SiC 外延生长中外延层/衬底界面附近的基底平面位错转换。 Song, H. & Sudarshan, TS 在4° 离轴4H-SiC Pina, H. & Sudarshan, TSPhetoho ea "planar dislocation" ea substrate haufi le moeli oa epitaxial layer / substrate nakong ea kholo ea epitaxial ea 4H-SiC ka ntle ho 4 ° axis.J. Crystal.Khōlo 371, 94-101 (2013).
Konishi, K. et al.Boemong bo phahameng ba hona joale, ho phatlalatsoa ha phoso ea "basal plane dislocation stacking" ka 4H-SiC epitaxial layers e fetoha li-filament edge dislocations.J. Kopo.fisiks.114, 014504 (2013).
Konishi, K. et al.Rala li-epitaxial layers bakeng sa li-SiC MOSFET tse sa senyeheng ka ho phunya libaka tse atolositsoeng tse nang le liphoso tsa tlhahlobo ea X-ray ea topographic.AIP Advanced 12, 035310 (2022).
Lin, S. et al.Tšusumetso ea sebopeho sa "basal plane dislocation" ho phatlalatsoeng ha phoso e le 'ngoe ea mofuta oa Shockley nakong ea ho senyeha ha hona joale ha 4H-SiC pin diode.Japane.J. Kopo.fisiks.57, 04FR07 (2018).
Tahara, T., et al.Nako e khuts'oane ea bajari ba li-epilayers tse nang le naetrojene e ngata ea 4H-SiC e sebelisetsoa ho hatella liphoso tsa ho bokellana ho li-piN diode.J. Kopo.fisiks.120, 115101 (2016).
Tahara, T. et al.Ho its'etleha ho ts'epo ea motho ea nang le ente ea sesebelisoa se le seng sa Shockley stacking ka har'a diode tsa 4H-SiC PiN.J. Kopo.Fisiks 123, 025707 (2018).
Mae, S., Tawara, T., Tsuchida, H. & Kato, tsamaiso ea M. Microscopic FCA bakeng sa tekanyo ea bophelo ea mojari e rarollotsoeng ka botebo ho SiC. Mae, S., Tawara, T., Tsuchida, H. & Kato, tsamaiso ea M. Microscopic FCA bakeng sa tekanyo ea bophelo ea mojari e rarollotsoeng ka botebo ho SiC.Mei, S., Tawara, T., Tsuchida, H. le Kato, M. FCA Microscopic System bakeng sa Litekanyo tsa Bophelo bo Tebileng bo Rarollotsoeng ke Mopalami ka Silicon Carbide. Mae, S., Tawara, T., Tsuchida, H. & Kato, M. 用于SiC 中深度分辨载流子寿命测量的显微FCA 系统 Mae, S., Tawara, T., Tsuchida, H. & Kato, M. For SiC medium-deptyMei S., Tawara T., Tsuchida H. le Kato M. Micro-FCA tsamaiso ea litekanyo tse tebileng tsa bophelo ba mojari ka silicon carbide.alma mater science Forum 924, 269-272 (2018).
Hirayama, T. et al.Kabo e tebileng ea nako ea bophelo ba bajari ka mekhahlelo e teteaneng ea 4H-SiC epitaxial e ile ea lekanngoa e sa senyehe ho sebelisoa tharollo ea nako ea ho monya le ho tšela leseli.Fetohela ho mahlale.metara.91, 123902 (2020).


Nako ea poso: Nov-06-2022